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Potting type

Pulished:2019-07-18Number:loading...Source:Shanghai Spark Technology Industrial Inc.

  In recent years, with the vigorous development of electrical products, electronic manufacturers use various materials for potting of electrical appliances to solve the waterproof, moisture-proof, insulation and confidentiality of electrical products. Currently, epoxy glue, silicone rubber and polyurethane are widely used. (PU) glue and hot melt adhesive, the following briefly introduces the characteristics of the above materials to facilitate the use of electrical engineers as a reference.

  1, epoxy adhesive: Most of them are hard and some are soft.

  Advantages: Good adhesion, can not be opened after potting, high hardness, good insulation performance, ordinary room temperature curing temperature is 100, temperature curing temperature is about 150 °C, and temperature resistance is above 300 degrees, but The price is high.

  Disadvantages: poor repairability.

  2, silicone potting glue: after curing is mostly soft.

  Advantages: high temperature resistance, long-term use at 250 ° C, heating curing type higher temperature resistance, better insulation performance than epoxy resin, withstand voltage above 10000V, moderate price, good repairability.

  Disadvantages: poor adhesion.

  3, polyurethane potting: adhesive, softness between epoxy and silicone.

  Advantages: good low temperature resistance.

  Disadvantages: general temperature resistance, generally not more than 100 ° C, more bubbles, must be vacuum cast.

  Cost:

  Organic silica gel>epoxy adhesive>polyurethane adhesive>hot melt;

  Note: The cost of the condensation type in the organic silica gel is close to that of the epoxy resin, and the modified epoxy resin is also close to the PU;

  Craftability:

  Epoxy adhesive>organic silica gel>thermosol>polyurethane adhesive;

  Note: PU because of its hydrophilicity, must be vacuum dried to get a better cured product, such as the cost of vacuum and drying is too high, so the hot melt is heated and dissolved, but overall its operability Still much simpler than PU;

  Electrical performance:

  Epoxy adhesive>organic silica gel>polyurethane adhesive>hot melt;

  Note: Addition of silicone or paraffin-type hot melt, some electrical characteristics are even higher than epoxy glue, such as surface resistivity;

  Heat resistance:

  Organic silica gel>epoxy adhesive>polyurethane adhesive>hot melt;

  Note: PU at a low price is not much better than hot melt.

  Cold resistance:

  Silicone resin>polyurethane>epoxy resin>hot melt;

  Note: The low temperature characteristics of many hot melts are also very good, mainly depending on the specific application requirements.

  After the liquid chemical is potted into the electrical product, it is solidified by condensation and solidified, thereby functioning as protection, insulation, sealing, waterproofing, and secrecy. Which type of potting material should be selected specifically should be selected according to the specific application requirements.

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